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TM
Peripheral Imaging Corporation
PI200MC-A4 200DPI CIS Module Engineering Data Sheet
Key Features
* Light source, lens, and sensor are integrated into a single module * 8 dpm resolution, 216 mm scanning length * 437m sec/line scanning speed @ 4.0MHz clock rate * Wide dynamic range * Analog output * 660 Red LED light source * Compact size - 20.5 mm x 21.5 mm x 232 mm * Low power * Light weight
General Description
The PI200M-A4 is a CIS module. It is a long contact image sensor, using MOS image sensor technology for high-speed performance and high sensitivity. The PI200M-A4 is suitable for scanning A4 size (216 mm) documents with 8 dots per millimeter resolution. Applications include document scanners, mark readers, and other office automation equipment.
Functional Description
The PI200M-A4 imaging array consists of 27 sensors, PI3020 produced by Peripheral Imaging Corp. The sensor is a monolithic chip with an array of 64 photo sensing elements, of which 27 are cascaded to provide 1728 photo-detectors. These cascaded chips are contiguously aligned in a single row and bonded to PCB. See Figure 1, PI200M-A4's
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Block Diagram. This configuration allows a stream of sequential video pixels to be read from its output port, i.e., starting from 1st pixel located next to the connector end of the module and continues to and through the last pixel, 1728th. Each chip contains a complete control circuitry. Integrated within monolithic chip is a set of multiplex switches, and a digital shift register to control the chips sequential readout. Additionally, the chips contain a chip selection switch that is interrogated in a sequence as each predecessor chip completes its scanning process.
GLED LED LED LED LED LED LED LED LED
VLED
ROD LENS
1726
PHOTO SENSORS
1 2 3 4 5 ----------------
1727
1728
VIDEO LINE
VN(-V)
VDD (+5)
SHIFT REGISTER
GRD
BUFFER
VIDEO AMPLIFIER
VOUT
CP
SP
GRD
Figure 1. PI200M-A4 Block Diagram
Figure 2, PI200M-A4's Cross Section, shows a mechanical cross section of the module's internal structure. Mounted in the module is number of components. These components function together to provide the module a complete integrated system. The LED light bar illuminates the documents through the window and reflection from the imaged documents is pickup and focused by the one-to-one graded indexed micro lens array. The lens, through the glass window, focuses the scanned images from the document onto the sensing plane of the sensor chips, which is mounted on the PCB. During the imaging process, the document is passed across the glass window's surface. The PCB board not only has the sensor chips mounted on it, but it has an on-board amplifier, a clock buffer for both the Start Pulse, SP, and the module's master clock, CP, buffer. This amplifier processes the pixel charges from the image sensor chips and converts them into voltage signal to produce a sequential stream of video at the output pin of the PI200M-A4 module.
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All these discussed components are housed in a small plastic housing which has a cover glass, the window. This housing with its sealed windows protects the imaging array, the micro lens assembly, and the LED light source from dust.
DOCUMENT SURFACE GLASS WINDOW
LIGHT PATH MODULE HOUSE
ROD LENS
D LE
R BA
SENSORS
PCB
INSIDE PICTORIAL OF MODULE
Figure 2. PI200M-A4 Cross Section
Pin Out Description
There is one connector located at the end of the module. The outline of the module in Figure 4 of the mechanical section illustrates the connector location. With the module window facing down on flat surface, with the viewer looking down on backside of the module, and with the connector's pins facing viewer, the connectors is located on the left hand end of the module. The connector is a 2.0mm dual 8-pin rows with a total of 16 pin connector, part # Berg 88054-X16. Its I/O designation is provided in Table 1. I/O Designation. Pin number 1 location is indicated on the module outline. All of the odd pins are on the bottom row with pin number one on the edge closest to end of module. All of even pins are on the top row with pin 2 located adjacent to the pin 1. Pin Number 1, 2 , 4 & 8 3 5&6 7 9 &10 11 & 12 13 & 14 15 & 16 Symbol Gnd Vout Vdd (+5V) SP Vn (-5V to -12V) CP GLED VLED Names and Functions Ground; 0V Analog Video Output Positive power supply Start Clock Pulse Negative power supply Sampling clock pulse Ground for the light source; 0V Supply for the light source
Table 1. I/O Designation
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Absolute Maximum Rating:
Parameter Power supply voltage Symbols Vdd Idd Vn In VLED ILED Input clock pulse (high level) Vih Input clock pulse (low level) Vil Maximum Rating 7.0 70 -15 20 5.75 600 Vdd -0.5 Units V mA V mA V mA V V
Table 2. Absolute Maximum Rating
Note, these are the absolute maximums and are not to be used in prolonged operation.
Operating Environment
Operating temperature Operating humidity Storage temperature Storage humidity Top Hop Tstg Hstg 0 to 50 10 to 85 -25 to+85 5 to 95
0
C % 0 C %
Table 3. Operating Environment Electro-Optical Characteristics (25 C)
Parameter Symbol Number of photo detectors Pixel to pixel spacing Line scanning rate(1) Tint Clock frequency(2) Bright output voltage Bright output(4) nonuniformity Adjacent pixel(5) nonuniformity Dark nonuniformity(6) Dark output voltage(6) Modulation transfer function(7) Parameter 1728 125 437 Units elements m sec MHz Volts % % mV mV % Note
@ 4MHz clock frequency
Fclk Up Upadj Ud Vd MTF
4.0 1.0 <+/-30 <25 <50 <75 >30
Table 4. Electro-optical characteristics at 25 C.
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Definition: (1) Tint is the line scanning rate or integration time. Tint is determined by the interval between two start pulses (SP). (2) Fclk is the main clock, CP, frequency. (3) Vpavg = a Vp(n)/1728 (4) Up = [(Vpmax - Vp) / Vp] x 100% or [(Vp - Vpmin) / Vp] x 100% (5) Upadj = MAX[ | (Vp(n) - Vp(n+l) | / Vp(n)] x 100% Upadj is the nonuniformity percentage pixel to pixel (6) Ud = Vdmax -Vdmin Vdmin is the minimum dark output voltage, Vd, with light source off. Vdmax: maximum dark output voltage, Vd, with light source off. Vd is measured between the reset level of the video and the dark video signal level. This fixed offset occurs because of the video line is reset to ground after each pixel and before the following pixel. However, because the video signal is amplified and the offset is adjusted to force the average dark video signal near ground, the average dark video signal is only few millivolts from ground and reset level will be below ground. (7) MTF = [(Vpmax - Vpmin) / (Vpmax + Vpmin)] x 100 [%] is the effective algorithm which is used to make the measurements. V(p)max: maximum output voltage at 4.0 lp/mm V(p)min: minimum output voltage at 4.0 lp/mm (8) lp / mm: line pair per mm
Recommended Operating Conditions (25 C)
Item Power Supply Symbol Vdd Vn. VLED Idd Ivn ILED Vih Vil Fclk Dclk CPH Tint Top Min 4.5 -4.5 4.5 42 5.0 300 Vdd-1.0 0 25 50(3) 0.347 25 Mean 5.0 -5 5 50 450 Vdd-.5 4.0 Max 5.5 -12 5.5 55 6.0 550 Vdd 0.8 5.0 Units V V V ma ma ma V V MHz % ns ms 0 C
Input voltage at digital high Input voltage at digital low Clock frequency Clock pulse high duty cycle Clock pulse high duration Integration time Operating temperature
5.0 50
Table 5. Recommended Operating Conditions (25 C)
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Switching Characteristics (25C)
to CP tprh tdh SP tds Vout tsh
tw
tdl
MODULE TIMING DIAGRAM
Figure 3. PI200M-A4 Timing Diagram
Each switch timing characteristics for the I/O clocks are defined in symbolic acronyms. There is a corresponding clock's switching times for each symbol on the timing diagram. These corresponding times for each symbol is given in the following Table 6. Item Clock cycle time Clock pulse width Clock duty cycle Prohibit crossing time of Start Pulse Data setup time Data hold time Signal delay time Signal settling time Symbol to tw tprh tds tdh tdl tsh Min. 0.20 50 25 15 10 35 20 90 Mean Max. 2.0 75 Units ms ns % ns ns ns ns ns
Table 6. Symbol Definitions for the Above Timing Diagram
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Mechanical Description
Figure 4 is an overview drawing of the module with approximate dimensions. If a detailed drawing is desired, especially for a design in application, a full size drawing is available upon request.
SC .5 82 23 .5 2 D
AN CT IO
N
E IR
82
END VIEW
o1.65 HOLE 1X1-M2 TAPSIZE USE (DP6) 20.250.2
1
21.5
SIDE TAPE
PIN 6.0 AD LIN E
RE
o2.20.05 HOLE 2X2-M2.6 TAPSIZE USE (DP6)
ALL DIMENSIONS IN MM UNLESS SPECIFIED
Figure 4. PI200M-A4 Module Outline
Printed in USA. All rights reserved. Specifications (c)2001 AMI Semiconductor. are subject to change without notice. Contents may not be reproduced in whole or in part without the express prior written permission of AMIS. Information furnished herein is believed to be accurate and reliable. However, no responsibility is assumed by AMIS for its use nor for any infringement of patents or other rights granted by implication or otherwise under any patent or patent rights of AMIS.
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11.5 0.2 15.50.2 16.20.2
7.10.2 THE SURFACE OF THE GLASS 1.25

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